Maestro A2200-A Manual do Utilizador descarregar pdf (Página 27)

V1.0 – Aug-13

User’s Manual

Page 27 of 37

7.3 Recommended Profile for Reflow Soldering

Typical values for reflow soldering of the module in convection or IR/convection

ovens are as follows (according to IPC/JEDEC J-STD-020D):

Parameter

Value

Peak temperature (RoHS compliant process)

245°C

Average ramp up rate to peak (217°C to Peak)

3°C / second max.

Preheat temperature

min=150°C; max=200°C

Ramp up time from min. to max. preheat temperature

60 … 120 seconds

Temperature maintained above 217°C

60 … 150 seconds

Time within 5°C of actual peak temperature

30 seconds

Ramp down rate

6°C / second max.

Time 25°C to peak temperature

8 minutes max.

Table 9: Reflow soldering profile A2235-H

As results of soldering may vary among different soldering systems and types of

solder and depend on additional factors like density and types of components on

board, the values above should be considered as a starting point for further optimi-

zation.

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Maestro A2200-A Manual do Utilizador Página 27